PCIe-Express9 – Backplane 9-Slot

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Express9-G3, 9-Slot PCIe Backplane

  • Nine slot PCI Express backplane – 8 x4 lane slots plus 1 x8 lane slot
  • One PICMG 1.3 SBC slot
  • Supports 8GB/s full duplex links between backplanes using HLink-G3 and SLink-G3
  • 48 lane PCIe 3.0 switch
  • Compatible with a standard 4U IPC chassis
  • Support for daisy chaining multiple backplanes

The backplane provides x8 lane PCI Express slots, all implemented as x16 physical connectors. For high density and high performance display controller systems. The backplane can be used with a standard PICMG 1.3 SBC as a stand alone system or in combination with multiple backplanes to provide a PCI Express expansion system for a standard PC.


Express 9 & 9-G3 Backplane


The EMS Express9 backplanes use advanced PCI Express switches to create a high bandwidth fabric that connects up to nine PCI Express plug-in cards into a host system.

The host can take the form of a Single Board Computer (SBC) which connects directly into the PICMG 1.3 system board slot of the Express9, creating a stand-alone 9 slot PC system. Alternatively a remote host can be connected into the Express9 backplane using EMS’s HLink-G3 and SLink-G3 products, transforming the Express9 into a 9 slot expansion backplane. Using multiple Express9 backplanes configured in expansion mode allows the construction of very large systems (up to 41 slots).

The Express9 backplanes provide nine 16-lane physical connectors, eight of which are electrically configured as 4-lane slots, and one of 8-lanes (slot 1). The eight lane slot can be used normally, or can accept a EMS HLink-G3 board to extend the PCI Express bus, over eight lanes, onto a subsequent Express9 expansion board.

The EMS Express9 uses PCIe 2.0 (Gen2) switching technology. The peak bandwidth available from the PICMG and slot 1 is 4 GB/s and the peak bandwidth from slots two to nine is 2 GB/s. The PICMG and the nine slots are all operating in bi-directional mode.

Express 9-G3 Backplane

The EMS Express9-G3 uses PCIe 3.0 (Gen3) switches to boost the data bandwidths to 4 GB/s and 8 GB/s respectively. Even when the Express9-G3 is expected to be used with plug in cards that are only Gen1 or Gen2 rated, the additional bandwidth can still be used to provide a peak bidirectional bandwidth between backplanes of 8 GB/s (using the HLink-G3 and SLink-G3 board pair). When used in this way as part of a multi-chassis data wall system, for example, this link bandwidth eliminates the bottleneck between capture cards in one chassis and display cards in another chassis. As a guide, the 8GB/s bandwidth can handle approximately 14 full HD streams at 60 Hz and 32 bits per pixel in either direction.

Connecting multiple Express9 & Express9-G3 backplanes

Star Connection or Daisy Chain. . This configuration provides a high number of available PCI Express slots supporting low latency.
All PCI Express slots in the master chassis (containing the SBC) are populated with a HLink-G3 card. Each HLink-G3 is then connected to an expansion chassis using an ExCable-G3 and SLink-G3 card

Product Name/Order Code Description
Express9 9 slot PCI Express Gen.2 Expansion backplane PCIe 2.0 switch
Express9-G3 9 slot PCI Express Gen.3 Expansion backplane PCIe 3.0 switch


Express9 & Express9-G3 Specification

Max Power (without SBC) 5W (Express9)
8W (Express9-G3)
Power Requirements Max current at +3.3V – 0.5A
Max current at +5V – 1.0A (1.5A for Express9-G3)
Form Factor ATX & PICMG mount compatible
Card Slots PICMG1.3 Host SBC interface
1 x PCIe (x8) expansion slot
8 x PCIe (x4) expansion slots
PSU Connections 4 x 24 pin ATX power connectors (Express9)
2 x 24 pin ATX power connectors (Express9-G3)
1 x 8 pin 12V AUX power input
1 x 8 pin
12V AUX power output local to SBC
(Express9-G3 provides voltage monitoring of all rails)
I/O Connections 2 x ports SATA 2 (from SBC via PICMG slot)
2 x ports USB 2.0 (from SBC via PICMG slot)
3 x 4-pin Fan headers (temp controlled)
Operating Temperature 0 to 35°C / 32 to 95°F
Storage Temperature -20 to 70°C / -4 to 158°F
Relative Humidity 5% to 90% non-condensing

We are continuously developing the technology used within our product ranges delivering outstanding innovative solutions, therefore the specification may change from time to time.